Last week Micron and IBM announced that Micron would be IBM’s main supplier of NAND flash chips. The week before Micron announced a strategic agreement with Seagate to supply NAND flash. Why all this activity?
It comes down to today’s budding NAND flash shortage and the fact that suppliers tend to groom their customer lists when supplies get short.
Neither IBM nor Seagate represent the enormous opportunities that major consumer electronics firms like Apple do. Since many NAND suppliers are very cost-focused they look for customers that need very little support and purchase in high volumes.
IBM and Seagate look for a lot of support, and, since they both ship mostly enterprise flash systems or SSDs, they consume relatively small unit volumes of NAND flash chips.
These companies need to have an understanding of Continue reading
Last week Toshiba and SK hynix announced an agreement to jointly develop Nano Imprint Lithography (NIL), building on a memorandum of understanding (MOU) that two companies signed in December last year. Development efforts will begin this April and practical adoption is expected to start in 2017. The collaboration is expected to reduce risk and accelerate commercialization of this technology.
NIL is expected to produce next-generation lithography at high throughput rates more economically than established lithography tools. It is should compete against Extreme Ultraviolet (EUV) lithography, an alternative technology whose use has been delayed by numerous technical challenges. EUV, a euphemism for X-Rays, cannot use transmissive optics like glass lenses, so a completely new reflective imaging technology has had to be developed to support its use. The advantage of EUV is that the light wavelength is only 13nm, which is an order of magnitude smaller than the 193nm light currently used to produce leading-edge chips, allowing it to print significantly smaller features.
Unlike today’s lithography, which uses a purely photographic process, NIL mechanically stamps a pattern into the photoresist in a similar manner to the sealing wax stamp shown in the photo (courtesy of BackToZero, a wax stamp maker). The stamp is produced using Continue reading
Everspin and Northwest Logic have just announced full interoperability between Northwest Logic’s MRAM Controller Core and Everspin Technologies’ ST-MRAM (Spin-Torque Magnetic RAM) chips. This interoperability is hardware proven on a Xilinx Virtex-7 FPGA and is now available for designs needing low-latency, high memory throughput using MRAM technology.
Since The Memory Guy knew that Everspin’s EMD3D064M ST-MRAM was fully DDR3 compatible, I had to wonder why the part would require a special controller – couldn’t it simply be controlled by any DDR3 controller?
Everspin’s product marketing director, Joe O’Hare, took the time to Continue reading
The Semiconductor Industry Association this week announced the year-end World Semiconductor Trade Statistics (WSTS) revenues for 2014. Worldwide sales grew 9.9% to reach a record total of $335.8 billion, outperforming the WSTS fall forecast. Annual sales increased in all four regional markets for the first time since 2010. Memory was the fastest growing segment, increasing 18.2%, partly based on DRAM growth of 34.7%.It’s encouraging that all geographical areas experienced growth. This implies that the world economy is finally on the mend.
The industry’s 9.9% worldwide growth was a good bit lower than Objective Analysis’ December 2013 prediction of growth in excess of 20%. We admit that we overshot, expecting both higher bit growth and stronger pricing in DRAM and NAND flash than actually materialized.
The $335.8 billion number is really Continue reading
Inotera recently announced earnings and posted an impressive 55% gross margin. Inotera is a pure-play DRAM maker, so it’s not too difficult to estimate the company’s process geometries based on its financials.
The Memory Guy thought it might be interesting to determine what I could from the 55% gross margin number.
First of all we can estimate Inotera’s manufacturing cost/GB based on the gross margin and an assumption about the company’s sales price/GB. The WSTS price per gigabyte for November was $7.83. Assuming that Inotera’s ASP was equal to this number, then at a gross margin of 55% the company’s cost/GB would have been $3.52.
Inotera’s acts as a foundry for Micron Technoogy. If Inotera sold to Micron at some lower price, then Inotera’s production costs would necessarily be proportionally lower to maintain the same gross margin.
Using the WSTS price: At a processed wafer cost of $1,600 (my rule of thumb) a $3.52/GB cost would require 454 8Gb dice to be produced Continue reading
In a move touted as a merger of equals, Cypress will acquire Spansion in an all-stock transaction slated to close in the second quarter of 2015. The purchase price is estimated at $1.6 billion.
Cypress points out that it is the leading producer of SRAMs, and that Spansion is the leading NOR flash provider.
One striking feature of this transaction is the Continue reading
SanDisk co-founder Eli Harari was awarded the National Medal of Technology and Innovation on November 20 by President Obama. The medal, which was bestowed upon Dr. Harari in a White House ceremony, is the United States’ highest honor for scientific and technological achievement, and recognizes those whose lasting contributions have created a greater understanding of the world and improved the lives of many.
Harari co-founded SanDisk more that 25 years ago with the vision that flash memory would be used to store data in mobile products, a vision that initially took seed in photography in the 1990s, and has since become the fastest-growing Continue reading
An article in a recent issue of Business Korea posits that Apple may be having trouble stemming from the company’s adoption of TLC flash in it’s new iPhone 6.
The article states:
considering that technical defects mainly occur in the 128GB version of the iPhone 6 Plus, there might be a problem in the controller IC of triple-level cell (TLC) NAND flash.
The problem has led to numerous warranty replacements and the looming prospects of a recall.
(Note that Continue reading
For those who were unable to attend the Flash Memory Summit, Samsung’s Senior VP of Memory R&D, Bob Brennan, announced in his keynote speech that a 3D 32-layer V-NAND, a chip that would achieve twice the chip density of planar NAND, was entering production and that SSDs would follow in a month. Now, two months later, Samsung has announced those SSDs.
This week’s release reiterates Continue reading