According to a Business Korea article Samsung announced, during a June 14 investor event, plans to reduce its DRAM capital spending and shift its focus to 3D NAND.
The Memory Guy sees this as an unsurprising move. This post’s chart is an estimate of DRAM wafer production from 1991 through 2014. There is a definite downtrend over the past few years. The peak was reached in 2008 at an annual production of slightly below 15 million wafers, with a subsequent dip in 2009 thanks to the global financial collapse at the end of 2008. After a slight recovery in 2010 the industry entered a period of steady decline.
The industry already has more than enough DRAM wafer capacity for the foreseeable future.
Why is this happening? The answer is relatively simple: the gigabytes per wafer on a DRAM wafer are growing faster than the market’s demand for gigabytes.
Let’s dive into that in more detail. The number of gigabytes on a DRAM wafer increases according Continue reading
The answer really depends upon who you ask. An article in the Financial Express quoted Samsung as saying that it would have a minimal impact, and that full-scale operations should resume in a few days. The article also said that Samsung estimated that the wafer loss would be below 10,000 wafers.
Assuming that the entire loss consisted of Samsung’s most advanced 48-layer 256Gb 3D NAND a 10,000-wafer loss would be less than 1% of total industry gigabyte shipments.
Korea Times quoted an anonymous fund manager who said: “The one-time incident will cost Samsung up to 20 billion won, which is very minimal. It won’t make heavy impact on Samsung’s chip business and the entire industry.”