Today Micron Technology announced that it is sampling the Hybrid Memory Cube (HMC) a DRAM packaging technology that it has been working on with the HMC Consortium.
Micron has been pushing to rapidly advance the HMC’s development and seems to have reached this point in an impressively brief time, given the complexity of the technology. It has only been two years since the first public appearance of the HMC at the 2011 Intel Developer Forum.
Some pretty advanced technology was used to make this product. DRAM processes are not very good at Continue reading