Macronix

Samsung Power Glitch – Is It Important?

3D NANDOn Saturday, June 18, Samsung’s Xian fab, the only facility in the world currently producing 3D NAND flash, suffered a power failure.  How much of a problem is this?

The answer really depends upon who you ask.  An article in the Financial Express quoted Samsung as saying that it would have a minimal impact, and that full-scale operations should resume in a few days.  The article also said that Samsung estimated that the wafer loss would be below 10,000 wafers.

Assuming that the entire loss consisted of Samsung’s most advanced 48-layer 256Gb 3D NAND a 10,000-wafer loss would be less than 1% of total industry gigabyte shipments.

Korea Times quoted an anonymous fund manager who said: “The one-time incident will cost Samsung up to 20 billion won, which is very minimal.  It won’t make heavy impact on Samsung’s chip business and the entire industry.”

According to Korean news source Chosenilbo the outage was caused by Continue reading

3D NAND: Making a Vertical String

Toshiba's Original BiCS Diagram - IEDM 2007Let’s look at how one form of 3D NAND is manufactured.  For this post we will explore the original design suggested by Toshiba at the IEEE’s International Electron Device Meeting (IEDM) in 2007.  It’s shown in the first graphic of this post.  (Click on any of the graphics for a better view.)

Toshiba calls this technology “BiCS” for “Bit Cost Scaling.”  The technique doesn’t scale the process the way the world of semiconductors has always done to date – it scales the cost without shrinking the length and width of the memory cell.  It accomplishes this by going vertically, as is shown in this post’s first graphic.

This takes a special effort. This is where the real Continue reading

Macronix Solves Flash Wear Problem

Macronix Headquarters, Hsinchu TaiwanThe December issue of the IEEE Spectrum includes a fascinating article about a 100 million cycle flash memory developed by Macronix.  The company will present this design at at IEDM this month.

In brief: Macronix’ researchers buried a heater in the array to heat the tunnel dielectric, annealing out the disruptions & traps that might cause a bit to fail.

A prototype has so far been tested more than 100 million cycles and it shows no sign of impending failure.  Researchers believe that it is likely to reach one billion or more cycles, but such testing will take several months.  This just may be able to Continue reading

New NAND Player: Macronix

Macronix NAND FlashMacronix, a company known for its leadership in mask ROMs and low-density NOR flash has just entered the NAND flash market.  This adds a new player to a very small pool of competitors: Samsung, Toshiba, SanDisk, Hynix, Intel, and Micron.

The company’s first NAND products are SLC chips of two densities: 512Mb and 1Gb.  Compare this to the offerings of the market’s other participants which range up to 256Gb.  Spot price tracker InSpectrum doesn’t even track pricing of densities below 4Gb!

There still seems to be a good market for these low-density parts: According to WSTS  Continue reading

Contact

Jim Handy Objective Analysis Memory Market Research +1 (408) 356-2549 Jim.Handy (at) Objective-Analysis.com

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