The answer really depends upon who you ask. An article in the Financial Express quoted Samsung as saying that it would have a minimal impact, and that full-scale operations should resume in a few days. The article also said that Samsung estimated that the wafer loss would be below 10,000 wafers.
Assuming that the entire loss consisted of Samsung’s most advanced 48-layer 256Gb 3D NAND a 10,000-wafer loss would be less than 1% of total industry gigabyte shipments.
Korea Times quoted an anonymous fund manager who said: “The one-time incident will cost Samsung up to 20 billion won, which is very minimal. It won’t make heavy impact on Samsung’s chip business and the entire industry.”
We would like to provide the following update on the recovery status of SK Hynix Wuxi fab that was affected by the fire on Wednesday September 4, 2013. The air ventilation system and cleanroom in the line that was affected by the fire have now been substantially restored, and we have resumed partial utilization in this line from Thursday October 10, 2013. We will gradually raise utilization and make every effort to recover normalized level of pre-fire utilization in November as planned.
This statement should put to rest Continue reading
In a surprise announcement Toshiba has said that it will immediately cut NAND flash production by approximately 30%. The company explains that this is being done “to reduce inventory in the market and improve the overall balance between supply and demand.” Toshiba’s release implies that this move is expected to improve prices, which have dropped as low as $0.31/GB recently.
By common measures of market share, which typically leave out SanDisk (for reasons too complex to discuss here) Toshiba holds a share of roughly 30% of the NAND flash market. By cutting its output by 30% Toshiba would be reducing overall NAND supply by 10%. If we were to include SanDisk, then that percentage would decrease to about 7.5%. Either one of these is significantly more than Continue reading