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Hybrid Memory Cube Making Progress

Conceptual Cutaway Drawing of the Hybrid Memory CubeOn Tuesday the HMC Consortium (that’s short for “Hybrid Memory Cube”) announced that members have agreed upon a specification.  The consortium has been moving rapidly, meeting its targets despite the revolutionary nature of the interface.

As a reminder, this technology stacks multiple DRAMs in a single package with a logic chip at the base of the stack that performs all the signalling to the rest of the system.  Signals between the DRAMs and logic chip use through-silicon vias (TSVs) as interconnections.  This allows the technology to deliver 15 times the performance of DDR3 at only 30% of the power consumption.  The Memory Guy first posted about the HMC in late 2011.

The consortium explains that the HMC interface already has 100 adopters, and that a few Continue reading

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