WIOMING

WIOMING: Another Spin on the Hybrid Memory Cube

ST-Ericsson & CEA-Leti WIOMING Multichip ModuleAt a Conference in San Francisco today (Tuesday December 13 ) ST-Ericsson and CEA-Leti presented a paper on something the companies called a: “Breakthrough 3DIC with Wide I/O Interface.”

This product appears to be a variation on the Hybrid Memory Cube, or HMC concept detailed in a prior post.

Remember that the HMC stacks a number of DRAM chips atop a logic chip.  The memories store data and communicate to the logic chip through thousands of through-silicon vias (TSVs) while the logic chip handles communications with the outside world. Continue reading

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Jim Handy Objective Analysis Memory Market Research +1 (408) 356-2549 Jim.Handy (at) Objective-Analysis.com

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