China foundry XMC has broken ground for its new 3D NAND flash fab, the country’s first China-owned 3D NAND flash facility. Plans for this fab were publicly disclosed over a year ago. Simon Yang, XMC’s CEO, gave a presentation at SEMI’s Industry Strategy Symposium (ISS) on January 11, 2015 in which he detailed the need for China to produce a larger proportion of its overall chips, explaining how his company would help make that happen.
Yang used the map in this post’s graphic to show that XMC has enough land on its campus for six 300mm wafer fabs. Two shells (yellow), each capable of processing 30,000 wafers per month, had been constructed by that time: Fab A (left) was already fully utilized, and Fab B (right) was ready for tooling. The gray boxes show that the site has enough space to build 2 additional 2-line megafabs, each with a capacity of up to 100k wafers per month. Accoding to DRAMeXchange XMC currently produces 20,000 wafers of NOR flash per month. A March 30 China Daily article reports that monthly wafer production will reach 300,000 in 2020 and 1 million in 2030.
XMC’s formal name is Wuhan Xinxin Semiconductor Manufacturing, and it is located Continue reading “XMC Breaks Ground for 3D NAND Fab”