In an investor conference call today Micron Technology announced that it would discontinue further development of the 3D XPoint memory that the company had developed in partnership with Intel, phasing out production and selling off the Lehi, Utah fab (pictured) that makes 3D XPoint.
Micron said that it has determined that the market for the product is too small to Continue reading “Micron Bows Out of 3D XPoint Business”
Microchip Technology is now shipping a memory chip that has been designed to provide the most popular features of emerging memory chips without using any non-standard semiconductor technologies. It’s as fast as an SRAM with the nonvolatility of an EEPROM.
Readers may recall that Tom Coughlin and I recently updated Continue reading “Microchip’s Answer to Emerging Memories”
SK hynix and Intel today announced that SK hynix will acquire Intel’s NAND flash business for $9 billion. SK hynix gets Intel’s business, its manufacturing plant with two fabs in Dalian, China, and all of Intel’s designs and intellectual property. The Memory Guy thinks this is a pretty good deal all around.
Intel doesn’t do well in Continue reading “SK hynix Acquires Intel’s NAND Business”
Micron Technology hosted its earnings call on September 29, and its outlook wasn’t as bad as formerly expected.
In August the company’s CFO warned that, although Micron’s fourth fiscal quarter (its current quarter, running from June – August) would come close to the guided figures, there was reason to Continue reading “Micron Earnings: Not So Bad After All”
During Intel’s latest earnings announcement the company provided information to indicate that 3D XPoint, which Intel sells under the name “Optane”, may have finally reached break-even: It may no longer be selling at a loss.
How would The Memory Guy know? Well, in fact, I don’t, but I can make an informed guess.
The chart below shows Continue reading “Did 3D XPoint Costs Reach Break-Even?”
In a May 15 press release SIA president & CEO John Neuffer said something that definitely bears repeating.
His statement was the Semiconductor Industry Association’s response to new US Department of Commerce rule changes designed to stop: “Huawei’s efforts to undermine US export controls.”
Recall that the SIA is the Continue reading “SIA CEO’s Priceless Comment”
The Memory Guy is pleased to announce the release of a new report co-authored by Objective Analysis and Coughlin Associates named: Emerging Memories Find Their Direction. In this report we show that emerging memories, MRAM, ReRAM, 3D XPoint, and other technologies are well on their way to reach $36 billion of combined revenues by 2030.
The report provides invaluable guidance to Continue reading “Emerging Memory Market to Hit $36 Billion by 2030”
A couple of weeks ago NAND flash start-up YMTC announced the production release of its 128-layer 1.33 terabit QLC NAND flash chip. According to a DigiTimes article about the chip the company plans to claim a share of 8% of the global NAND flash market in 2021.
A number of my clients asked The Memory Guy about this, since YMTC doesn’t yet seem Continue reading “Can YMTC Really Win 8% of 2021’s NAND Flash Market?”
Forecasting the memory market can be quite daunting unless you use the appropriate tools, then it becomes enormously simple. Many of my clients ask The Memory Guy how it is that I am able to come up with such consistently-acurate forecasts in a seemingly-unpredictable market. My answer is always that I use the Smith Chart. This chart is a nomogram, presented in an angular/logarithmic format (as opposed to Continue reading “Forecasting with Smith Charts”
About a year ago a rumor was circulating that Samsung was unable to yield its sub-20nm products without using EUV for the finer processes. Since The Memory Guy doesn’t traffic in rumors I did not publish anything about this rumor at the time.
On March 25 the company verified the rumor, though, by issuing a statement that: “Samsung is the first to adopt EUV in DRAM production.” I found it interesting that the company turned something that was Continue reading “Samsung Admits to Needing EUV for Sub-20nm Nodes”