(The following is an update of a post that originally ran on 1 November 2013. It was republished in 2024 as a part of a series to honor the 3D NAND inventors who have received the 2024 FMS Lifetime Achievement Award.)
Let’s look at how one form of 3D NAND is manufactured. For this post we will explore Continue reading “3D NAND: Making a Vertical String”
(The following is an update of a post that originally ran 25 October 2013. It was republished in 2024 as a part of a series to honor the 3D NAND inventors who have received the 2024 FMS Lifetime Achievement Award.)
In the prior post we discussed the need to go vertically into the body of the die, since NAND flash can not Continue reading “What is a 3D NAND?”
(The following is an update of a post that originally ran 18 October 2013. It was republished in 2024 as a part of a series to honor the 3D NAND inventors who have received the 2024 FMS Lifetime Achievement Award.)
A memory chip of a certain area costs about the same amount to produce, no matter how many bits it holds. Naturally, the more bits you can cram onto this chip, the cheaper the price per bit will be. Low cost is of the utmost Continue reading “Why Do We Need 3D NAND?”
Last week’s FMS conference, originally the Flash Memory Summit, but now the Future of Memory and Storage, saw a strong return of the show’s original excitement and attendance, with numerous presentations on key new technologies, largely AI and CXL, and crowds similar to those before the pandemic. FMS is held in early August every year in Santa Clara, California.
The new name is meant to match the show’s content better than Continue reading “FMS – New Focus and a Heavy AI and CXL presence”
Back in 2013, when Samsung announced its V-NAND, the first production 3D NAND, The Memory Guy blog carried a series of posts to explain the new technology and the reason it was so necessary.
Now that the inventors of this technology have been honored with the FMS Lifetime Achievement Award, I decided that it was time to refresh that series of blog posts. Once a week for the next nine weeks I will be reissuing a post in this series. I hope that these will Continue reading “What is 3D NAND? Why do we need it? How do they make it?”
FMS (formerly the Flash Memory Summit) announced on July 24 that a research team from Kioxia will receive the award for inventing 3D NAND flash at FMS: the Future of Memory and Storage, on August 6 in Santa Clara, California. We hope to see you there as the award is being presented to a member of that team.
The team has five Continue reading “3D NAND Team to Receive FMS Lifetime Achievement Award”
At long last a chip has been embodied to simplify the use of virtual memory, a computing architecture that has been in use since the 1960s. The Memory Guy was given a sneak peek at this new approach by no other than Olly Mugwump, a highly-respected computer architect and longstanding member and fellow of several important technical societies. The new design promises to accelerate memory accesses while Continue reading “Finally! A Real Virtual Memory Chip”
I was saddened to hear last week of the death this month of Simon Sze, the co-inventor of the floating gate, which was the basis of EPROM, E²PROM, and nearly all flash memory prior to the advent of 3D NAND, which uses a charge trap instead.
Dr. Sze was not only responsible for the floating gate, but he was a pioneer in Continue reading “Remembering Simon Sze”
In this post in The Memory Guy blog, the first of a 2-part series, Ron Neale returns to explore the present state-of-play for chalcogenide-based switching and memory, with a plea for continuation of research. Along the way he invokes a three-point law for determining the probability of success for would be emerging memory entrepreneurs.
Does PCM still have a chance to become an important new memory technology? Intel’s abandonment of their Optane memory project, while sad, after so much effort and expense, does not and should not Continue reading “The Future of Chalcogenide Switching”
The Memory Guy is pleased to announce the availability of a new Objective Analysis Brief, which is our name for a white paper. It’s called The Future of the Data Center.
The paper explores the new horizons of computing, including disaggregation, AI, IoT, etc., and explains the many different memory approaches that are being used or developed to enable these technologies, ranging from computational storage to DDR5 and CXL
Look for it at the top of the list of free documents on our White Papers page at Objective-Analysis.com.
