The Memory Guy recently had a rare opportunity of a private fab tour at the Monolithastery, a memory fab in Saint Gobain Pont-à-Mousson, France. This facility combines a very traditional monastery with a semiconductor wafer fabrication plant. It’s the only such Continue reading “Visit to a Monolithastery”
Every so often a new idea comes into an established industry from an unexpected direction and creates a dramatic change to the way that the industry operates. In today’s post The Memory Guy will explain a radical new chip production process will rapidly change the nature and cost structure of the entire semiconductor industry, DRAM and NAND flash first, slashing costs and waste while phenomenally increasing output.
This revolutionary approach stems from Continue reading “Tectonic Change Coming to Chip Production”
The Memory Guy today became aware of a significant breakthrough in magnetic memory technologies (MRAM) that could prove to be a big bonus for mobile applications. These memories could be used to generate power as well as to store data.
Scientists have only recently become aware of an oversight stemming from the fact that nearly all spin magnetics research has been performed in the northern hemisphere. Just as the water in a drain rotates counterclockwise in the northern hemisphere but clockwise in the southern hemisphere, the Coriolis Effect dictates that magnetic spin has the opposite sense above the equator as below.
This surprise finding was made when researchers from Stüdpfalz University of Blindman’s Bluff, Iowa, brought samples of an STT MRAM they had developed to the Magnetic Island and City of Townsville Metropolitan University in Queensland, Australia, where researchers have been producing similar magnetic memories below the equator. Until that moment neither team had thought to question the Continue reading “MRAMs to Power Cell Phones”
In a new cross-disciplinary effort, researchers have developed a novel approach to attach bonding wires to stacks of memory chips. The new technique, being called a “breakthrough” by its developers, promises to allow chips to be stacked to several times their current 8-chip and 16-chip heights.
At issue is the challenge of precisely bonding wires a fraction of the diameter of a human hair over great distances without their inadvertently coming into contact with their neighbors to create a short circuit. Such a short could destroy one or more of the chips in the stack, rendering the entire stack useless. The mechanical means of attaching these wires, although highly sophisticated, still has significant issues, that limit the economics of higher stacks.
Researchers at the Berea University of Geology (BUG) in Berea, Kentucky, noticed that certain Continue reading “New Memory Bonding Technique Shows Promise”