At the IEEE’s IEDM conference last week Belgian research consortium imec showed an improved “gate first” 3D NAND that replaced the conventional polysilicon channel with InGaAs, Indium Gallium Arsenide, a III-V material. This new technique opens the door to higher layer counts in 3D NAND, allowing denser parts to be made in support of further cost reductions.
For those unfamiliar with the term, the “gate first” approach is the foundation of Toshiba’s BiCS NAND, and presumably Micron’s floating gate 3D NAND.
imec explains that “Replacing poly-Si as a channel material is necessary, as it is not suitable for long-term scaling.” Further they report that on-state current (ION) and transconductance (gm) of the III-V channel was better than that of polysilicon devices, without any programming, erase, or endurance degradation. The device’s characteristics are shown in this post’s graphic.
The consortium reports that the current through the Continue reading “New Materials Solve Key 3D NAND Issue”