Tessara’s Invensas subsidiary has announced a new packaging technology to produce what the company calls a “DIMM in a Package.”
The new product is said to deliver the capacity and performance of an SO-DIMM in a 16x16mm BGA. It is built using Invensas’ xFD technology.
I have seen examples of Invensas’ xFD and the first thought that struck me was: “Why didn’t I think of that?!?” It’s an elegantly simple approach to today’s connection conundrums. By staggering chips and mounting them face-down over holes for bonding wires the company connects DRAMs with far shorter interconnect lengths and less scrambling, leading to higher performance.
Although this technology is not yet covered in any of our current reports, we do have a report on cell phone packages: Flash Packaging: What Phone Makers Want and Why, that can be purchased for immediate download on the Objective Analysis website.
