DensBits – Making TLC Act Like MLC

DensBits' Soft Decoding yields 15x better ECC than 24-bit BCHDensBits, an Israeli start-up, has introduced a new technology and a new product today.  The company’s new eMMC controller, the DB3610, embodies DensBits’ “Memory Modem” technology, which is a blend of ECC, DSP, and flash management that the company says can give TLC flash endurance superior to that of MLC flash with performance nearly as good as competing controllers can provide with MLC.

That’s a big claim!

DensBits’ Memory Modem views NAND flash as a noisy communications channel, using those algorithms developed to support deep Continue reading “DensBits – Making TLC Act Like MLC”

How Cheap is Flash?

Fry's Advertisement: 32GB Patriot USB for $17The Memory Guy was a little surprised to see the advertisement in this post’s graphic.  It was from an April 8 newspaper ad for Fry’s Electronics.

It’s a little early to see NAND selling for this little: The original price of $21.99 for a 32GB USB flash drive comes to $0.69/GB, and the price after the rebate of $16.99 means that the price per gigabyte of the flash is only $0.53!

At the time the lowest spot market pricing for MLC flash on the InSpectrum spot price website was $0.53, and $0.47 for TLC.  According to DRAMeXchange MLC is selling for as little as $0.48.

That’s not a lot of margin for Patriot or Fry’s when you add in the cost of t Continue reading “How Cheap is Flash?”

NAND Flash Turns 25!

Toshiba celebrates the 25th Birthday of FlashOn April 3 Toshiba celebrated the 25th anniversary of NAND flash.  The technology, developed by Toshiba researcher Fujio Masuoka, was not expected to succeed, as explained in Eli Harrari’s keynote for ISSCC in February.

Toshiba said in a release that the company’s “commemoration of the 25th anniversary of the invention of NAND flash will continue throughout 2012,” and will include “notable industry events and consumer participation.”

There is certainly reason to celebrate.  This technology has grown faster than any semiconductor market in history, Continue reading “NAND Flash Turns 25!”

Intel Sells NAND Assets

IMFT's Manassas Fab, one of Two Sold to MicronToday Intel divested itself of a portion of the assets of IMFT, the joint venture NAND flash manufacturing arm it shares with Micron Technology.  This is an effort by Intel to groom the business to better suit Intel’s evolving vision of its role in the NAND flash business.

Objective Analysis issued an Alert to our clients giving the “What, When, Why, and Where” of this deal.  The Alert can be downloaded for free from the Objective Analysis Reports page.

Inside SanDisk’s & Toshiba’s New 128Gb NAND Chip

The Toshiba/SanDisk 128Gb NAND Flash ChipOne memory chip was so important that it was presented three times at this week’s International Solid State Circuits Conference (ISSCC) and that was the Toshiba/SanDisk 128Gb NAND flash.  This chip was shown by Eli Harari in Monday’s keynote, then was featured twice in the Wednesday afternoon Nonvolatile Memories session – once by Toshiba and once by SanDisk.

The NAND chip, measuring 170.6mm², is said by both companies to be the densest NAND available.  Compared to the Intel/Micron 64Gb 20nm NAND at 118mm², the device gives twice the bits in a 45% larger die area, so the companies’ claim rings true, since the only other NAND makers: Samsung and Hynix, have processes that fall far behind at 27nm and 26nm respectively.

Continue reading “Inside SanDisk’s & Toshiba’s New 128Gb NAND Chip”

Micron Suffers Another Loss

Jim GarrettSoon after the death of Micron president Steve Appleton, former chairman & COO Jim Garrett passed away.  Garrett died at age 64 from cancer.

Garrett joined Micron in 1985 as vice president of sales & marketing and became vice chairman in 1990.  He served as chairman and chief operating officer from 1992-1994 until his resignation over allegations that another boardmember released internal company information.

Garrett had a good reputation as  a positive manager who helped guide Micron through a very difficult period for the US DRAM industry.

New NAND Player: Macronix

Macronix NAND FlashMacronix, a company known for its leadership in mask ROMs and low-density NOR flash has just entered the NAND flash market.  This adds a new player to a very small pool of competitors: Samsung, Toshiba, SanDisk, Hynix, Intel, and Micron.

The company’s first NAND products are SLC chips of two densities: 512Mb and 1Gb.  Compare this to the offerings of the market’s other participants which range up to 256Gb.  Spot price tracker InSpectrum doesn’t even track pricing of densities below 4Gb!

There still seems to be a good market for these low-density parts: According to WSTS  Continue reading “New NAND Player: Macronix”

DRAM Consolidation in 2012?

History of DRAM Market Share by Company2012 is likely to be a year in which the DRAM market consolidates a little bit more.

Consider this:

  • At its peak in the late 1980s the DRAM market sported 23 suppliers.
  • Today there are 6 suppliers of any note: Samsung, Hynix, Micron, Elpida, Nanya, and Powerchip
  • The already-depressed market is only going to worsen in 2012.  Capital spending in 2010 is seeing to that.  Although many believe that prices cannot get any lower, that is exactly what they will do in 2012. Continue reading “DRAM Consolidation in 2012?”

Micron, Intel, Introduce 128Gb NAND Chip

IMFT 20nm NAND Flash DieMicron Technology and Intel announced today (6 December, 2011) that the two companies are sampling a 128 gigabit (that’s 16 gigabytes) NAND flash chip manufactured by the company’s IMFT joint venture.

This is a doubling of the capacity of the 64Gb chip the companies announced in April, but they assure us that the size of the die hasn’t doubled, and the accompanying photo supports this.  Intel tells us that the die will fit into standard BGA and TSOP packages. Continue reading “Micron, Intel, Introduce 128Gb NAND Chip”

IBM to Build Micron Hybrid Memory Cube

Conceptual Cutaway Drawing of the Hybrid Memory CubeIn a December 1 press release IBM announced that the company will be manufacturing Micron Technology’s Hybrid Memory Cube (HMC) which IBM claims to be “the first commercial CMOS manufacturing technology to employ through-silicon vias (TSVs).”

This device is one that Altera, Intel, Micron, Open Silicon, Samsung, and Xilinx have all presented recently as a plausible solution to the difficulty of increasing the speed of DRAM/processor communications.  The Hybrid Memory Cube Consortium (HMCC) website offers a deep dive into the details of the consortium and the technology.

Continue reading “IBM to Build Micron Hybrid Memory Cube”