Recently Rambus announced that it was using cryogenic temperatures to boost computer performance in large datacenters. This research is being done in a joint project with Microsoft who is developing a processor based on Josephson Junctions.
This is an effort to provide a performance increases greater than can be attained through standard semiconductor scaling. The research project aims to attain improvements in cycle time, power consumption, and compute density, leading to better energy efficiency and cost of ownership (COO). The companies hope to gain side benefits of being able to squeeze more bits onto a DRAM chip thus reducing cost per bit, improving performance, and making DRAM chips less costly to produce.
The system these two companies are researching uses a memory system that is cooled to 77 degrees Kelvin (77°K) with a processor that operates at 4°K. To do this the memory system is bathed in liquid nitrogen while the processor is cooled by liquid helium. The temperatures are the boiling points of these two liquids.
Surprisingly, the fact that these two subsystems are in different Continue reading “Super-Cooled DRAM for Big Power Savings”
Objective Analysis has just introduced a new report that you might want to consider: A Close Look At The Micron/Intel 3D XPoint Memory.
The report covers the Intel-Micron 3D XPoint memory and includes Intel’s new Optane support products that are based on this technology. The report explains the technology and its special manufacturing challenges. It includes details of how 3D XPoint memory will be used, and provides an analysis of the benefits of its persistent nature.
Forecasts project how the market will develop and include optimistic and pessimistic forecast scenarios. Particular attention has been paid to its impact upon the DRAM, SSD, and other markets. Finally, the report analyzes different end-market segments to predict how this technology will impact each of them.
The Memory Guy, report author Jim Handy, will present the report’s findings during the Pre-Conference Primer of the Storage Network Industry Association (SNIA) Storage Developer Conference (SDC) this Sunday, September 20, at 2:00 PM, In Santa Clara, CA.
This breakthrough report is based on Continue reading “New Report: 3D XPoint Memory”
DRAM manufacturers often refer to “The Windows Bump” – a phenomenon that is believed to occur after every release of a new version of the Windows operating system. According to this theory DRAM demand increases for a period following an introduction.
An example: in a recent article Kingston VP Scott Chen said that an increase in sales for Windows 8 might help raise DRAM demand, leading to more stable prices.
Demand is expected to pick up on the upcoming launch of Windows 8 tablets and Ultrabook PCs later in the second half of 2012.
Does the Windows Bump really exist? The Memory Guy thought Continue reading “Does the ‘Windows Bump’ Really Exist?”
At the Intel Developer Forum in mid September Kingston Technology demonstrated a prototype of an intriguing product certified by Microsoft to support the Windows To Go version of Windows 8 Enterprise. The device, called the DataTraveler Workspace (or DT Workspace for short) is more than the simple USB flash drive it resembles.
While a USB flash drive or thumb drive contains little more than a USB flash controller and some NAND flash, the DT Workspace includes a full SSD (based on a standard SandForce controller) plus DRAM. Windows compatible systems and certain other systems can boot through the USB port with full operation securely remaining Continue reading “Kingston’s ‘Windows To Go’ Thumb Drive”