On Tuesday the HMC Consortium (that’s short for “Hybrid Memory Cube”) announced that members have agreed upon a specification. The consortium has been moving rapidly, meeting its targets despite the revolutionary nature of the interface.
As a reminder, this technology stacks multiple DRAMs in a single package with a logic chip at the base of the stack that performs all the signalling to the rest of the system. Signals between the DRAMs and logic chip use through-silicon vias (TSVs) as interconnections. This allows the technology to deliver 15 times the performance of DDR3 at only 30% of the power consumption. The Memory Guy first posted about the HMC in late 2011.
The consortium explains that the HMC interface already has 100 adopters, and that a few Continue reading “Hybrid Memory Cube Making Progress”