Back in 2013, when Samsung announced its V-NAND, the first production 3D NAND, The Memory Guy blog carried a series of posts to explain the new technology and the reason it was so necessary.
Now that the inventors of this technology have been honored with the FMS Lifetime Achievement Award, I decided that it was time to refresh that series of blog posts. Once a week for the next nine weeks I will be reissuing a post in this series. I hope that these will be a useful resource for Memory Guy readers.
The series aims to answer three important questions:
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- What exactly is 3D NAND?
- Why does the industry need to go to a 3D topology?
- How the heck do they make such a product?
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To answer these questions I assembled a series of articles posted as weekly segments on The Memory Guy blog during the fourth quarter of 2013. These were updated, week by week, in August through October of 2024.
The different sections are listed below, with hot links to each section.
- Why Do We Need 3D NAND?
- What Is a 3D NAND?
- Making a Vertical NAND String
- An Alternative Kind of Vertical 3D NAND String
- How Do You Access the Control Gates?
- Benefits of Charge Traps over Floating Gates
- How Do You Erase and Program 3D NAND?
- 3D NAND’s Impact on the Equipment Market
- Who Will Make It and When?
Each of these is a topic that is complex enough to warrant its own post, so for each of the nine weeks I published a post to explain each one in depth. I hope you find it engaging and informative.
(Originally published 11 October 2013. Updated 9 August, 2024)
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