The Sandisk/Kioxia BiCS8 NAND

"Peelback" sketch of the top (array) and bottom (logic) layers of a hybrid-bonded NAND flash chipAt the ISSCC conference last month Kioxia and Sandisk provided more details on the BiCS8 NAND flash chip that the companies will be shipping soon.

BiCS8 is the next generation of the two companies’ jointly-developed 3D NAND technology.  Although today’s volume product is very different from Toshiba’s originally-disclosed BiCS process, so far the process changes have largely been Continue reading “The Sandisk/Kioxia BiCS8 NAND”

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