For months rumors have abounded regarding Elpida’s viability and plans the company has to overcome its current financial woes. Although the company has been questioned about advanced payments and loans from its customers, takeover and merger possibilities, and even government intervention, Elpida has remained silent, refusing to comment.
Today the company finally made a statement that it will be adding a note to its Q3 results and earnings report: “on Matters concerning the Assumed Going Concern.”
This statement, which looks like it was written very carefully by either Continue reading “Elpida Finally Makes Statement”
Today Micron CEO Steve Appleton was killed in an airplane accident. Objective Analysis has issued an alert to our clients and subscribers giving details of the wreck, Appleton’s contributions to the company, and some thoughts on the company’s succession. The Alert can be viewed by visiting the Objective Analysis Reports page.
Most of all my thoughts and sympathies go to Appleton’s family and his former co-workers, all of whom are mourning his death. Although we realize that Mr. Appleton will be missed, but we know that Micron will continue to follow the path set up by Appleton’s predecessor, Micron founder Jerry Parkinson, to maintain its position as one of the leading memory chip suppliers.
2012 is likely to be a year in which the DRAM market consolidates a little bit more.
- At its peak in the late 1980s the DRAM market sported 23 suppliers.
- Today there are 6 suppliers of any note: Samsung, Hynix, Micron, Elpida, Nanya, and Powerchip
- The already-depressed market is only going to worsen in 2012. Capital spending in 2010 is seeing to that. Although many believe that prices cannot get any lower, that is exactly what they will do in 2012. Continue reading “DRAM Consolidation in 2012?”
At a Conference in San Francisco today (Tuesday December 13 ) ST-Ericsson and CEA-Leti presented a paper on something the companies called a: “Breakthrough 3DIC with Wide I/O Interface.”
This product appears to be a variation on the Hybrid Memory Cube, or HMC concept detailed in a prior post.
Remember that the HMC stacks a number of DRAM chips atop a logic chip. The memories store data and communicate to the logic chip through thousands of through-silicon vias (TSVs) while the logic chip handles communications with the outside world. Continue reading “WIOMING: Another Spin on the Hybrid Memory Cube”
I got a phone call yesterday from Russell Fish of Venray Technology. He wanted to talk about how and why computer architecture is destined for a change.
I will disclose right up front that he and I were college classmates. Even so, I will do my best to give the unbiased viewpoint that my clients expect of me.
Russell is tormented by an affliction that troubles many of us in technology: We see the direction that technology is headed, then we consider what makes sense, and we can’t tolerate any conflicts between the two.
In Russell’s case, the problem is the memory/processor speed bottleneck.
Continue reading “A Change to Computing Architecture?”
In a December 1 press release IBM announced that the company will be manufacturing Micron Technology’s Hybrid Memory Cube (HMC) which IBM claims to be “the first commercial CMOS manufacturing technology to employ through-silicon vias (TSVs).”
This device is one that Altera, Intel, Micron, Open Silicon, Samsung, and Xilinx have all presented recently as a plausible solution to the difficulty of increasing the speed of DRAM/processor communications. The Hybrid Memory Cube Consortium (HMCC) website offers a deep dive into the details of the consortium and the technology.
Continue reading “IBM to Build Micron Hybrid Memory Cube”