Memory Issues in Space & Medical Applications

How an alpha particle disrupts a memory bitThe Memory Guy was recently asked about using memories in a satellite. What would be a good technology to use in a space application?

The problem with space is that there is a lot of radiation.  Radiation on the earth’s surface is lower because it is stopped by the atmosphere, but in space there is an abundance of radiation that interferes with most semiconductors.  Radiation is also a concern in certain medical applications where a memory must maintain its contents while undergoing sterilization through irradiation.  Experiments on conventional flash memories have shown data loss at only 2% of the Continue reading “Memory Issues in Space & Medical Applications”

Alternative Memory Technologies Patiently Wait For Market to Explode

Cross Section of a PCM Bit CellLane Mason of Objective Analysis recently shared with The Memory Guy an article he wrote for the 4 April 2007 Denali Memory Report covering Phase Change Memory (PCM or PRAM.)  It looked like something big was about to happen with the technology: PCM looked nearly ready to enter production.

The article included an excerpt of an EE Times interview with Micron’s CEO, the late Steve Appleton, in which Appleton stated that PCM advocates threatened to take over the memory market in 2000.

Here it is 2012, and PCM represents little more than a drop in the bucket when it comes to memory sales, although Continue reading “Alternative Memory Technologies Patiently Wait For Market to Explode”

WIOMING: Another Spin on the Hybrid Memory Cube

ST-Ericsson & CEA-Leti WIOMING Multichip ModuleAt a Conference in San Francisco today (Tuesday December 13 ) ST-Ericsson and CEA-Leti presented a paper on something the companies called a: “Breakthrough 3DIC with Wide I/O Interface.”

This product appears to be a variation on the Hybrid Memory Cube, or HMC concept detailed in a prior post.

Remember that the HMC stacks a number of DRAM chips atop a logic chip.  The memories store data and communicate to the logic chip through thousands of through-silicon vias (TSVs) while the logic chip handles communications with the outside world. Continue reading “WIOMING: Another Spin on the Hybrid Memory Cube”