One memory chip was so important that it was presented three times at this week’s International Solid State Circuits Conference (ISSCC) and that was the Toshiba/SanDisk 128Gb NAND flash. This chip was shown by Eli Harari in Monday’s keynote, then was featured twice in the Wednesday afternoon Nonvolatile Memories session – once by Toshiba and once by SanDisk.
The NAND chip, measuring 170.6mm², is said by both companies to be the densest NAND available. Compared to the Intel/Micron 64Gb 20nm NAND at 118mm², the device gives twice the bits in a 45% larger die area, so the companies’ claim rings true, since the only other NAND makers: Samsung and Hynix, have processes that fall far behind at 27nm and 26nm respectively.
Continue reading “Inside SanDisk’s & Toshiba’s New 128Gb NAND Chip”
The annual International Solid State Circuits Conference (ISSCC) is a gathering in which the brightest minds in semiconductors come to meet and share the results of their recent research and development efforts. This year the four keynotes at the opening plenary centered on a “Green” outlook, through Storage, Control, Computing, and Energy.
Naturally, as “The Memory Guy,” I focused all of my attention upon the storage keynote, given by SanDisk’s recently-retired CEO Eli Harari. Some of the more interesting points I came away with were: Continue reading “Harari Delivers Inspiring Keynote at ISSCC”
Soon after the death of Micron president Steve Appleton, former chairman & COO Jim Garrett passed away. Garrett died at age 64 from cancer.
Garrett joined Micron in 1985 as vice president of sales & marketing and became vice chairman in 1990. He served as chairman and chief operating officer from 1992-1994 until his resignation over allegations that another boardmember released internal company information.
Garrett had a good reputation as a positive manager who helped guide Micron through a very difficult period for the US DRAM industry.
For months rumors have abounded regarding Elpida’s viability and plans the company has to overcome its current financial woes. Although the company has been questioned about advanced payments and loans from its customers, takeover and merger possibilities, and even government intervention, Elpida has remained silent, refusing to comment.
Today the company finally made a statement that it will be adding a note to its Q3 results and earnings report: “on Matters concerning the Assumed Going Concern.”
This statement, which looks like it was written very carefully by either Continue reading “Elpida Finally Makes Statement”
Hynix Semiconductor has a new name. Through SK Telecom’s November 2011 purchase of 21.1% of Hynix’ shares from its creditors mobile phone service provider SK has acquired controlling interest of the company and is re-branding Hynix as SK-Hynix.
The Memory Guy has not discussed this with either Hynix or SK Telecom so far, but it seems unusual that a 21.1% stake in a company would gain a controlling interest.
Suffice it to say that Hynix’ creditor banks, who have been trying to divest themselves of their ownership of Hynix for a few years, have finally found Continue reading “Hynix is now SK-Hynix”
Macronix, a company known for its leadership in mask ROMs and low-density NOR flash has just entered the NAND flash market. This adds a new player to a very small pool of competitors: Samsung, Toshiba, SanDisk, Hynix, Intel, and Micron.
The company’s first NAND products are SLC chips of two densities: 512Mb and 1Gb. Compare this to the offerings of the market’s other participants which range up to 256Gb. Spot price tracker InSpectrum doesn’t even track pricing of densities below 4Gb!
There still seems to be a good market for these low-density parts: According to WSTS Continue reading “New NAND Player: Macronix”
Today Micron CEO Steve Appleton was killed in an airplane accident. Objective Analysis has issued an alert to our clients and subscribers giving details of the wreck, Appleton’s contributions to the company, and some thoughts on the company’s succession. The Alert can be viewed by visiting the Objective Analysis Reports page.
Most of all my thoughts and sympathies go to Appleton’s family and his former co-workers, all of whom are mourning his death. Although we realize that Mr. Appleton will be missed, but we know that Micron will continue to follow the path set up by Appleton’s predecessor, Micron founder Jerry Parkinson, to maintain its position as one of the leading memory chip suppliers.
Elpida announced the development of a high-speed 64Mb non-volatile resistance memory (ReRAM) prototype using a 50nm process. The device was jointly developed with the New Energy and Industrial Technology Development Organization (NEDO), a Japanese-funded public institution.
Elpida will conduct further ReRAM development with Sharp Corporation, the National Institute of Advanced Industrial Science and Technology (AIST, another Japanese public institution) and the University of Tokyo.
It’s encouraging to see that Elpida still has its eye on projects into 2013 and beyond. The company is rumored to be working feverishly to find ways to stay in business through this year. Today’s DRAM market is a challenging one!
Continue reading “Elpida ReRAM Prototype”
2012 is likely to be a year in which the DRAM market consolidates a little bit more.
- At its peak in the late 1980s the DRAM market sported 23 suppliers.
- Today there are 6 suppliers of any note: Samsung, Hynix, Micron, Elpida, Nanya, and Powerchip
- The already-depressed market is only going to worsen in 2012. Capital spending in 2010 is seeing to that. Although many believe that prices cannot get any lower, that is exactly what they will do in 2012. Continue reading “DRAM Consolidation in 2012?”
Micron Technology and Intel announced today (6 December, 2011) that the two companies are sampling a 128 gigabit (that’s 16 gigabytes) NAND flash chip manufactured by the company’s IMFT joint venture.
This is a doubling of the capacity of the 64Gb chip the companies announced in April, but they assure us that the size of the die hasn’t doubled, and the accompanying photo supports this. Intel tells us that the die will fit into standard BGA and TSOP packages. Continue reading “Micron, Intel, Introduce 128Gb NAND Chip”